Job / Role Summary
The Staff Engineer delivers module/sub-module ownership in NAND Advanced Thin Films process development, owning defined portions of the process space (dielectric/carbon film processes via CVD/Diffusion) and driving robustness, capability, and integration readiness. Success requires strong hands-on deposition/characterization skills, cross-functional execution discipline, and the ability to translate experimental results into scalable process improvements.
Main Responsibilities
Process Development & Optimization
Develop,optimize, and characterize thin film processes (CVD/Diffusion) to meet performance, reliability, and manufacturability targets.
Execute well-designed experiments, analyze data, and translate results into process improvements.
Support scaling of dielectric and carbon film processes across nodes and platforms.
Module Ownership (Growing Scope)
Own defined portions of a process module or sub-module under guidance from senior engineers; track margins, sensitivities, and integration risks.
Drive issue resolution for process and tool-related problems within assigned scope.
Process Integration & Correlation
Work closely with integration and device teams to ensure compatibility and structural/electrical performance.
Correlate material, structural, and electrical data to guide process optimization; support failure analysis and root-cause investigations.
Tool & Hardware Engagement
Build strong hands-on knowledge of dielectric/carbon film equipment behavior; support tool qualifications, upgrades, and transfers; partner with suppliers to improve stability/capability.
Other Responsibilities
Communicate results clearly through reports, reviews, and data summaries; escalate risks with data-driven recommendations.
Mentor junior engineers and contribute to team knowledge sharing.
Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.
Candidate Profile
Minimum Qualifications / Experience
PhD≥3 yrs, or Master’s ≥5yrs, or Bachelor’s ≥7yrsof relevant experience in
Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field,
Demonstrated thin film R&D / PD experience and ability to link process conditions to material properties/device behavior.
Must-Have Technical Skills
Thin film deposition fundamentals (CVD/Diffusion) and materials/chemistry/process physics.
Familiarity withfabmetrology and film characterization methods (structural/mechanical/optical/electrical as applicable).
Working knowledge of plasma processes, vacuum systems, and chemical reactions.
Must-Have Soft Skills
Strongexecutionownership and structured troubleshooting.
Cross-functional collaboration and concise technical communication.
Highly Desirable / Preferred
Understanding NAND thin film structure and electrical needs.
Embody Micron’s core values:
People–Respect, develop and empower others
Innovation–Drive continuous improvement and breakthrough thinking
Tenacity–Show grit and determination
Collaboration–Build trust and foster teamwork
Customer Focus–Deliver excellence and value