Company Description
The Bosch Group is a leading global supplier of technology and services. Since the beginning of 2013, its operations have been divided into four business sectors: Automotive Technology, Industrial Technology, Consumer Goods, and Energy and Building Technology.
The Bosch Group comprises Robert Bosch GmbH and its roughly 360 subsidiaries and regional companies in some 50 countries. If its sales and service partners are included, then Bosch is represented in roughly 150 countries. This worldwide development, manufacturing, and sales network is the foundation for further growth.
Bosch Global Software Technologies Company Limited (BGSV) is 100% owned subsidiary of Robert Bosch GmbH - one of the world’s leading global suppliers of technology and services, offering end-to-end Engineering, IT, and Business Solutions.
Starting its operation from 2010 at Etown 2 in HCMC, BGSV is the first software development center of Bosch in Southeast Asia. BGSV nowadays have over 4,000 associates, with a global footprint and presence in the US, Europe, and the Asia Pacific region.
With our unique ability to offer end-to-end solutions that connect sensors, software, and services, we enable businesses to move from the traditional to digital or improve businesses by introducing a digital element in their products and processes.
Job Description
Job Description
Lead PCB layout for automotive HPC and chiplet platforms, delivering manufacturable designs with design teams and external suppliers. Improve efficiency through AI-enabled automation, process and library management, and team mentoring.
Key Responsibilities:
- Own multilayer/HDI placement, fine-pitch BGA escape, and routing from approved schematics and mechanical constraints through release.
- Route DDR/LPDDR, PCIe, Ethernet, and SerDes to SI/PI constraints; implement power/ground, decoupling, and thermal/EMC requirements.
- Coordinate design, SI/PI, mechanical, manufacturing teams, and external PCB suppliers on stack-ups, materials, vias, cost, reliability, and manufacturability.
- Manage footprints, pad stacks, and ECAD libraries; improve request, naming, validation, approval, versioning, traceability, reuse, and obsolescence processes.
- Lead layout/DRC and DFM/DFA/DFT reviews, resolve supplier issues, and release Gerber/ODB++, drill, stack-up, drawing, placement, and BOM data.
- Mentor layout engineers; maintain layout guidelines and checklists, and guide application notes and customer presentations explaining trade-offs and risks.
- Improve development handovers, reviews, change control, and release workflows using reusable practices, lessons learned, and supplier feedback.
- Apply AI-assisted tools and scripting to layout checks, library verification, and documentation; validate outputs, protect design data, and measure cycle-time, quality, and rework improvements.
Qualifications
Qualifications
- Bachelor’s degree in Electrical/Electronic Engineering or equivalent.
- 10+ years in complex high-speed PCB layout, with end-to-end ownership and design-team/supplier coordination; automotive experience preferred.
- Expertise in multilayer/HDI stack-ups, BGA escape, microvias, via-in-pad, fabrication capabilities, and reliability trade-offs.
- Strong DDR/LPDDR, PCIe, Ethernet, and SerDes routing skills: impedance, timing, differential pairs, crosstalk, return paths, and SI/PI.
- Proficient in Cadence Allegro, Altium Designer, or equivalent; experienced in constraint management, libraries, and revision-controlled releases.
- Knowledge of PCB fabrication/assembly, DFM/DFA/DFT, relevant IPC standards, and manufacturing deliverables.
- Experience improving development/library processes and applying scripting, ECAD automation interfaces, and AI tools with validated efficiency gains.
- Experience mentoring engineers and preparing layout guidelines, application notes, and customer technical presentations.
Soft skills
- Results-oriented, structured, and quality-driven; strong analysis, root-cause problem-solving, and independent ownership.
- Proactive collaboration across global teams and external suppliers.
- Clear English communication, technical writing, and customer presentation skills.
Additional Information
Further details regarding compensation and benefits will be shared during the interview process.